The function of microporous integral vacuum diffusion bonding: microporous bonding is a technical problem in the world. At present, only Germany and the United States have microporous bonding technology, and the metal connection of microporous materials is realized by chemical etching. Stoll uses the whole vacuum diffusion bonding technology to realize the metal connection of microporous multilayer materials, which is the first in the world.
Applications: Nuclear power, thermal energy, chemical, pharmaceutical, etching processing.
Stoll can use the whole vacuum diffusion bonding process to process various types, materials, sizes of microporous products according to customer drawings, the minimum aperture size can be up to 0.05 mm, the minimum thickness of each layer can be up to 0.02 mm, diffusion bonding layer number can be 1000 layers!
Item name | Microporous multilayer vacuum diffusion bonding |
ODM&OEM | Yes |
MOQ | 1 pc |
Supply ability | 10000 piece/pieces per month |
Port | Shenzhen |
Delivery time | 5-10 working days |
Payment terms | L/C, D/A, D/P, T/T |